Method for polishing a substrate surface
US7323414B2 · kind B2 · utility
4Cited by
10References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 28, 2006 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Feb 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AlN substrate surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.