Sensor device
US7327004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2005 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Jan 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.