Semiconductor device package
US7327015B2 · kind B2 · utility
44Cited by
17References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2004 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | May 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.