Heat treating apparatus and method
US7327947B2 · kind B2 · utility
10Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2005 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Oct 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/324
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat treating apparatus for heat treating a substrate by irradiating the substrate with light includes a heat treating chamber for receiving the substrate, a heating plate for preheating the substrate through a thermal diffuser plate, xenon flashlamps for heating the substrate preheated by the heating plate, to a treating temperature by irradiating the substrate with flashes of light, and a decompression mechanism for decompressing the heat treating chamber when the xenon flashlamps heat the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.