Cobalt and nickel electroless plating in microelectronic devices
US7332193B2 · kind B2 · utility
8Cited by
26References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.