Apparatus for temporary thermal coupling of an electronic device to a heat sink during test

US7332927B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul J. Aube · Vergennes, US
• Normand Cote · Bedford, US
• Roger Gamache · South Burlington, US
• David L. Gardell · Saint Albans, US
• Paul M. Gaschke · Beacon, US
• Marc D. Knox · Mechanicsville, US
• Denis Turcotte · Granby, CA

Key dates

• Filing date: May 3, 2007
• Grant date: Feb 19, 2008
• Expiry date: May 3, 2027

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2868
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.