Method of making a semiconductor device having an opening in a solder mask
US7335571B2 · kind B2 · utility
5Cited by
22References
54Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.