Patent · US Expired

Method of depositing a layer of a material on a substrate

US7338872B2 · kind B2 · utility

1Cited by

3References

11Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Christoph Schwan · Gebhardshain, DE
Thomas Feudel · Radebeul, DE
Thorsten Kammler · Radeberg, DE

Key dates

Filing date	Dec 10, 2004
Grant date	Mar 4, 2008
Priority date	—
Expiry date	Nov 17, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH10D64/021
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention makes it possible to precisely deposit a material adjacent a feature on a substrate. A layer of the material is deposited on the substrate. The layer is planarized and exposed to an etchant. The etchant is adapted to selectively remove the material. The exposing of the layer to the etchant is stopped prior to a complete removal of the layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.