Method and apparatus for classifying repetitive defects on a substrate
US7339663B2 · kind B2 · utility
3Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | May 29, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95607
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.