Edge inspection
US7340087B2 · kind B2 · utility
5Cited by
35References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2004 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Apr 5, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8841
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.