Digital camera module package fabrication method
US7342215B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Jun 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
Abstract
A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.