Multiple chips image sensor package
US7345360B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Feb 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-chip image sensor module includes a first substrate; a photosensitive chip arranged on an upper surface of the first substrate; a lens holder mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel arranged within the lens holder and formed with a chamber and an opening communicating with the chamber; an aspheric lens and a transparent layer placed within the chamber; a second substrate mounted on the first substrate and electrically connected to the first substrate; and a lower chip located on a second surface of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.