Patent · US Expired

Semiconductor device with a rewiring level and method for producing the same

US7345363B2 · kind B2 · utility

0Cited by

14References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Minka Gospodinova-Daltcheva · Munich, DE
Harry Huebert · Aschheim, DE
Rajesh Subraya · Birkenfeld, DE
Jochen Thomas · Munich, DE
Ingo Wennemuth · Munich, DE

Key dates

Filing date	Feb 27, 2006
Grant date	Mar 18, 2008
Priority date	—
Expiry date	Feb 27, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.