Method and structure for interfacing electronic devices
US7348217B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2006 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Sep 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.