Semiconductor device and a method for manufacturing the same
US7352588B2 · kind B2 · utility
23Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Mar 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/145
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.