Flip chip bonded package applicable to fine pitch technology
US7355286B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2006 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Jul 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip bonded package applicable to a fine pitch technology uses, inter alia, insulative posts instead of using conductive bumps, which correspond to electrodes one by one. The insulative posts are assigned to every two bonding pads for the sake of flip chip bonding. This makes it possible to fabricate flip chip bonded packages very easily without modifying conventional processes. Larger bumps are provided even in the case of a technology having the same pad size and pitch during flip chip bonding. This makes the subsequent attachment process easy and reduces the defective ratio. The insulative posts, when made of a polymer, also act as stress buffers. This improves the reliability of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.