Inventor · Daega-myeon, KR

Seong Cheol Kim

37Patents
6h-index
61Co-inventors
72Inventor score

Filing activity: Jul 1, 1997 → Nov 3, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7795139B2 Method for manufacturing semiconductor package Electricity 32 Active
US7898834B2 Semiconductor chip with chip selection structure and stacked semiconductor package having the same Electricity 16 Active
US8478292B2 Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recorded Physics 13 Active
US7710377B2 LCD panel including gate drivers Physics 10 Active
US7795073B2 Method for manufacturing stack package using through-electrodes Electricity 9 Active
US8592952B2 Semiconductor chip and semiconductor package with stack chip structure Electricity 6 Active
US5888056A Diaphragm pump Human Necessities 6 Expired
US7446405B2 Wafer level chip scale package (WLCSP) with high reliability against thermal stress Electricity 5 Active
US7005791B2 Flat panel for cathode-ray tube Electricity 3 Expired
US8232642B2 Printed circuit board Emerging Cross-Sectional Technologies 3 Active
US7333549B2 Method and apparatus for estimating a signal sequence in a MIMO-OFDM mobile communication system Electricity 2 Expired
US8198719B2 Semiconductor chip and semiconductor package including the same Electricity 2 Active
US8395245B2 Semiconductor package module Electricity 2 Active
US7595255B2 Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same Electricity 2 Active
US8823161B2 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures Electricity 1 Active
US8042020B2 Data error correction circuit, integrated circuit for data error correction, and method of performing data error correction Electricity 1 Active
US9577948B2 Method and apparatus for connecting to server using trusted IP address of domain Electricity 1 Active
US8399984B2 Semiconductor package Electricity 1 Active
US8237291B2 Stack package Electricity 1 Active
US8766457B2 Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package Electricity 1 Active
US7355286B2 Flip chip bonded package applicable to fine pitch technology Electricity 1 Active
US7859102B2 Multi-layer stacked wafer level semiconductor package module Electricity 1 Active
US10784706B2 Wireless power transmitter and method for controlling the same Electricity 0 Active
US10749132B2 Electrode laminate and organic light emitting device element Electricity 0 Active
US8681133B2 Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signal Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.