Chemically amplified positive photo resist composition and method for forming resist pattern
US7358028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Jun 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/122
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a chemical amplification type positive photoresist composition which is excellent in storage stability as a resist solution in a bottle. A novolak resin or a hydroxystyrenic resin is reacted with a crosslinking agent to give a slightly alkali-soluble or alkali-insoluble resin having such a property that solubility in an aqueous alkali solution is enhanced in the presence of an acid, which is then dissolved in an organic solvent, together with (B) a compound generating an acid under irradiation with radiation to obtain a chemical amplification type positive photoresist composition wherein the content of an acid component is 10 ppm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.