Patent · US Active

Method and apparatus for imager quality testing

US7358517B2 · kind B2 · utility

1Cited by
13References
22Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 5, 2006
Grant dateApr 15, 2008
Priority date—
Expiry dateSep 5, 2026

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N21/8806
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.