Thermally enhanced molded package for semiconductors
US7361985B2 · kind B2 · utility
26Cited by
27References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2004 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Apr 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.