Bennett A. Joiner
8Patents
6h-index
12Co-inventors
56Inventor score
Filing activity: Sep 28, 1990 → Oct 27, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5105259A | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation | Electricity | 121 | Expired |
| US5734201A | Low profile semiconductor device with like-sized chip and mounting substrate | Electricity | 69 | Expired |
| US5147821A | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation | Electricity | 63 | Expired |
| US5483098A | Drop-in heat sink package with window frame flag | Electricity | 48 | Expired |
| US7361985B2 | Thermally enhanced molded package for semiconductors | Electricity | 26 | Expired |
| US5683944A | Method of fabricating a thermally enhanced lead frame | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6847102B2 | Low profile semiconductor device having improved heat dissipation | Electricity | 3 | Expired |
| US6933599B2 | Electromagnetic noise shielding in semiconductor packages using caged interconnect structures | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.