Method for utilizing a meniscus in substrate processing
US7363727B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2006 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jun 5, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a substrate is provided. The method includes applying an active agent to an active region of a surface of the substrate. Then, the method includes generating a fluid meniscus on the surface of the substrate with a proximity head, where the fluid meniscus is surrounding the active region. In one example, processing the surface of the substrate with the active agent includes one of an etching operation, a cleaning operation, a rinsing operation, a plating operation, or a lithography operation, and processing the surface of the substrate with the fluid meniscus includes one of an etching operation, a cleaning operation, a rinsing operation, a plating operation, a drying operation, or a lithography operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.