Polishing head for polishing semiconductor wafers
US7364496B2 · kind B2 · utility
7Cited by
14References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Feb 28, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.