Diffusion solder position, and process for producing it

US7368824B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Khalil Hosseini · Weihmichl, DE
• Edmund Riedl · Bergneustadt, DE

Key dates

• Filing date: Aug 27, 2004
• Grant date: May 6, 2008
• Expiry date: May 7, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided.