Thermal wafer processor
US7371998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2006 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.