Modular probe card
US7372286B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 3, 2006 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | May 27, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.