Systems and methods for inspecting a wafer with increased sensitivity
US7372559B2 · kind B2 · utility
3Cited by
10References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Nov 2, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.