Substrate holder which is self-adjusting for substrate deformation
US7372690B2 · kind B2 · utility
8Cited by
9References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | May 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck is designed to allow the substrate to thermally deform during charged particle beam lithography. The wafer chuck includes a compliant layer disposed over an chuck body. During lithography processing the wafer is electrostatically held in contact with a flexible compliant layer and the wafer is exposed to the charged particle beam resulting in thermal deformation of the wafer. The compliant layer deforms with the substrate and allows the wafer to deform in a predictable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.