Semiconductor sensor and manufacturing method therefor
US7373821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2006 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.