Die package with asymmetric leadframe connection
US7375415B2 · kind B2 · utility
15Cited by
9References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Oct 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.