Method of making circuitized substrate with split conductive layer and information handling system utilizing same
US7377033B2 · kind B2 · utility
1Cited by
15References
13Claims
0Family size
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Key dates
| Filing date | Dec 20, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Dec 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.