Rapid conductive cooling using a secondary process plane
US7378618B1 · kind B1 · utility
357Cited by
16References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.