Thermal processing apparatus and thermal processing method
US7381928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2005 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Nov 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor wafer and the light source is so adjusted as to attain predetermined intensity of irradiation. The distance of irradiation between the thermal diffuser and the hot plate and the light source can be changed or corrected by vertically moving the thermal diffuser and the hot plate. The thermal processing apparatus which uses the flash lamps, is thus capable of readily controlling the intensity of irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.