Device for inspecting micro structure, method for inspecting micro structure and program for inspecting micro structure
US7383732B2 · kind B2 · utility
6Cited by
9References
30Claims
0Family size
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Key dates
| Filing date | Jun 10, 2005 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Jul 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0842
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.