Semiconductor device tester
US7385195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2005 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Sep 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24564
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and method is disclosed for obtaining information regarding one or more contact and/or via holes on a semiconductor wafer. In one embodiment, the method obtains information regarding one or more holes (for example, via or contact) that are disposed in a semiconductor wafer or disposed in a layer which is disposed on or above the semiconductor wafer. The method of this embodiment comprises irradiating the one or more holes with an electron beam; and determining information relating to a bottom diameter or a bottom circumference of the one or more holes using data which is representative of an amount of substrate current which is generated in response to irradiating the one or more holes with an electron beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.