Method of using an aqueous solution and composition thereof
US7387970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Sep 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for processing semiconductor wafers is disclosed. A semiconductor wafer is provided to a semiconductor processing stage where a block copolymer surfactant (BCS) is applied to the wafer surface. In one embodiment, the BCS includes a hydrophobic portion and a hydrophilic portion. Alternatively, the BCS may be a silicone-containing BCS. In one embodiment, the BCS is within an aqueous solution where the concentration of the BCS within the aqueous solution is less than one percent by weight. Also disclosed is an aqueous solution including abrasive particles and a BCS having a hydrophobic portion and a hydrophilic portion. The abrasive particles may include silica, alumina, or ceria.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.