Package stacking lead frame system
US7388280B2 · kind B2 · utility
9Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2005 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Dec 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads, molding a molding compound around the first die and the dual row of terminal leads and mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.