Integrated circiut arrangement

US7388734B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thomas Benetik · Munich, DE
• Uwe Hodel · Munich, DE
• Christoph Kienmayer · Unterhaching, DE
• Martin Streibl · Petershausen, DE
• Marc Tiebout · Birkenfeld, DE

Key dates

• Filing date: Oct 31, 2005
• Grant date: Jun 17, 2008
• Expiry date: Nov 20, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D89/601

Abstract

Integrated circuit arrangement having first and second signal input pads, to which a differential input signal is applied, and first and second signal outputs, at which a differential output signal is provided. The first signal output is coupled to the first signal input pad and the second signal output is coupled to the second signal input pad. A first capacitance is between the first and second signal input pads. First and second inductances are connected in series, are between the first and second signal input pads, and are connected in parallel with the first capacitance. A first terminal is at a first supply potential and a second terminal is at a second supply potential. A first electrostatic discharge element is between the first and second terminals. A second electrostatic discharge element is between the first terminal, on the one hand, and the first and second inductances, on the other hand.