Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7390687B2 · kind B2 · utility
45Cited by
75References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Oct 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
Abstract
Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.