Steven Oliver
39Patents
11h-index
48Co-inventors
75Inventor score
Filing activity: Apr 18, 2001 → Oct 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7300857B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 135 | Expired |
| US7390687B2 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers | Electricity | 45 | Active |
| US7452743B2 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Electricity | 44 | Active |
| US7683458B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 33 | Active |
| US9305956B2 | Optical assembly including plenoptic microlens array | Electricity | 27 | Active |
| US9184199B2 | Optical assembly including plenoptic microlens array | Electricity | 27 | Active |
| US7133197B2 | Metal-dielectric coating for image sensor lids | Physics | 26 | Expired |
| US7190039B2 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers | Electricity | 23 | Expired |
| US9419049B2 | Optical assembly including plenoptic microlens array | Electricity | 23 | Active |
| US7425499B2 | Methods for forming interconnects in vias and microelectronic workpieces including such interconnects | Electricity | 21 | Expired |
| US7397066B2 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers | Electricity | 18 | Expired |
| US7696588B2 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers | Electricity | 11 | Active |
| US7956443B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 10 | Active |
| US7923298B2 | Imager die package and methods of packaging an imager die on a temporary carrier | Electricity | 10 | Active |
| US7749899B2 | Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces | Electricity | 9 | Active |
| US7169248B1 | Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6701043B2 | Arrayed waveguide grating having a reflective input coupling | Physics | 9 | Expired |
| US9848113B2 | Multi-band biometric camera system having iris color recognition | Physics | 9 | Active |
| US8324100B2 | Methods of forming conductive vias | Electricity | 6 | Active |
| US7560371B2 | Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum | Electricity | 5 | Active |
| US8669179B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 5 | Active |
| US6865323B2 | Athermal optical coupler | Physics | 4 | Expired |
| US8502353B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 4 | Active |
| US7993944B2 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers | Electricity | 2 | Active |
| US9077901B2 | Light field image capture device having 2D image capture mode | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.