Patent · US Expired

Electronic module having plug contacts and method for producing it

US7391103B2 · kind B2 · utility

1Cited by

23References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Bernd Goller · Otterfing, DE
Robert-Christian Hagen · Sarching, DE
Simon Jerebic · Regensburg, DE
Jens Pohl · San Luis Obispo, US
Holger Woerner · Regensburg, DE
Peter Strobel · Regensburg, DE

Key dates

Filing date	Aug 27, 2004
Grant date	Jun 24, 2008
Priority date	—
Expiry date	Sep 15, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.