Non-stick detection method and mechanism for array molded laminate packages
US7391104B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2005 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Oct 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging device includes a laminate substrate. A first surface of the substrate can be mounted on an integrated circuit and the second surface can be mounted on a surface of a printed circuit board. The device can also include an array of lead contact pads on the first surface that can provide wire bond connections to circuit contact pads in the integrated circuit, and an array of solder ball contact pads on the second surface. Routing layers can provide electrical coupling between the lead contact pads on the first surface and the solder ball contact pads on the second surface. A dedicated contact pad on the first surface is electrically coupled to the laminate substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.