Chamber for wafer cleaning and method for making the same
US7392815B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer processing chamber “chamber” is provided. Broadly speaking, the chamber allows a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. More specifically, the chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. In this manner, the removable plates can be used to create a pressure differential between the inner volume within the chamber and the outer volume within the chamber. A lower pressure in the outer volume within the chamber requires less outer chamber strength to withstand the lower pressure. A lower outer chamber strength requirement translates into an overall decrease in chamber size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.