Conductive adhesive rework method
US7393419B2 · kind B2 · utility
13Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2007 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Jul 31, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.