Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7397066B2 · kind B2 · utility
18Cited by
76References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Dec 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.