Pre-molded leadframe and method therefor
US7399658B2 · kind B2 · utility
63Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2006 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Jul 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.