Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP
US7400037B2 · kind B2 · utility
4Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | May 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.