Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
US7402254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2003 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Mar 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.