Semiconductor package fabrication
US7402507B2 · kind B2 · utility
7Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.