Conductive adhesive composition
US7405247B2 · kind B2 · utility
20Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2007 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Jul 31, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.